Commerce Selects Sites for CHIPS R&D Facilities

Researchers work inside the clean room area at the MacroTechnology Works facility in the ASU Research Park in Tempe, Arizona. The park will host one of the three flagship facilities within the National Semiconductor Technology Center.
Deanna Dent / Arizona State University
The Commerce Department has selected sites for all three flagship R&D facilities within the National Semiconductor Technology Center, a multi-billion-dollar initiative funded by the CHIPS and Science Act to foster domestic semiconductor innovation. The facilities will be in Arizona, California, and New York and aim to bring together researchers from across industry and academia to accelerate semiconductor research and manufacturing. They are set to become operational within the next four years.
The site announcements came amid the Commerce Department’s push
On Monday, the Commerce Department announced
“This groundbreaking effort will mean that researchers and startups won’t need to go to China or Europe to test out their cutting-edge prototype microchips—they’ll be able to do that right here in America,” Sen. Mark Kelly (D-AZ) said in a press release.
The prototyping capability will initially focus on advanced computing, including training and inferencing of AI models, according to the facilities plan. The PPF’s prototyping capabilities will also support research towards future materials and device innovations in interconnect and embedded memory, the plan adds.
The other two flagship facilities, whose expected sites were announced in the fall, are the Design and Collaboration Facility
The Design and Collaboration Facility will be based in Sunnyvale in Silicon Valley and will host programmatic activities such as the Workforce Center of Excellence, as well as research capabilities in chip design, electronic design automation, chip and system architecture, and hardware security.
The Extreme Ultraviolet Accelerator will provide access to EUV technology with standard numerical aperture capabilities by 2025 and higher ones by 2026. Higher NA allows for more intricate printing on a transistor so that more transistors can fit on one chip wafer, giving each chip greater processing power. The Commerce Department and Natcast said they will initially spend up to $825 million
The California administrative and design facility is planned to become operational in 2025, the New York EUV facility in 2026, and the Arizona PPF in 2028. The Commerce Department and Natcast also plan to announce information about the selection process for NSTC-affiliated technical centers
“By the decade’s end, the NSTC should be viewed throughout the world as a vital membership community with stakeholders and resources across the semiconductor ecosystem, including state-of-the-art facilities, effective programs, a network of respected scientists and engineers, and demonstrated technical achievements,” the NSTC strategic plan
Some of President-elect Donald Trump’s advisors have floated the idea of clawing back CHIPS funds in the upcoming administration. Vivek Ramaswamy, who Trump tapped to lead the planned “Department of Government Efficiency,” described